Open to analog/mixed-signal roles, 2027

Girish Arora

MSE Electrical Engineering, University of Pennsylvania (May 2027)

Analog and mixed-signal IC design, nanofabrication, power electronics

About

I am an MSE Electrical Engineering student at the University of Pennsylvania, graduating May 2027. My work sits between analog IC design and the fab. I design circuits in Cadence (a 45 nm TIA, an SRAM array) and I also grow and characterize the films those circuits depend on. At Penn's Quattrone Nanofabrication Facility I am developing an ALD process for aluminum-doped zinc oxide as a replacement for ITO. Before Penn I did a B.E. in Electronics and Communication at Thapar in India and spent a summer building motor driver hardware and firmware for warehouse robots.

Long term, I want to work on analog and mixed-signal silicon in the US and then build a semiconductor manufacturing business in India.

Education

  • University of Pennsylvania, School of Engineering and Applied ScienceAug 2025 to May 2027

    Master of Science in Engineering, Electrical Engineering

  • Thapar Institute of Engineering and TechnologySep 2021 to Jun 2025

    Bachelor of Engineering, Electronics and Communication. GPA 3.89/4.0.

    Merit-III Scholarship, 2nd and 3rd year, top 10% of class.

Girish in a full cleanroom gown, hood, and safety glasses

Experience

Quattrone Nanofabrication Facility (QNF), Penn

Graduate Student Fellow

Sep 2026 to present

I am developing an atomic layer deposition (ALD) process for aluminum-doped zinc oxide (AZO) as a replacement for ITO. I grow ZnO:Al films on a Cambridge S200 ALD tool, fit each film's optical response with spectroscopic ellipsometry in WVASE, and use XRD and my own Python analysis to tie doping level to film properties.

  • 200 °C doping series from DEZ, TMA, and H2O at 99:1, 49:1, and 19:1 ZnO:Al cycle ratios.
  • Ellipsometry fits give 85 to 88 nm film thickness at fit MSE below 7.
  • 0.2 eV Burstein-Moss band-edge shift (3.35 to 3.58 eV) and free-carrier absorption at 19:1, consistent with literature.
source detector AZO filmsubstrate Ψ, Δ ZnO:Al 99:149:119:1 band edge 3.35 eV 3.33.43.53.6 eV
Ellipsometry: band edge shifts with Al doping

p-Chip Corporation, Philadelphia

Hardware Development Intern

Jun 2026 to Aug 2026

I worked on a mirror driver board for p-Chip's laser reader. An oscillating mirror sweeps the beam to extend the reader's working distance. The mirror is a resonant load, so the drive circuit has to hold a clean sine at resonance with stable amplitude and phase. I took it from the first scope measurement to a design ready to build. Penn ESE wrote about this internship.

sine drive laser mirror sweep
Resonant mirror sweeping the beam

Addverb Technologies, India

Embedded Systems Intern

Jan 2025 to Jul 2025

I built motor-drive hardware and firmware for Zippy warehouse robots. I designed a BLDC motor driver board, wrote STM32 firmware for its current-sense amplifier with moving-average filtering, and integrated an R320M Wi-Fi 6 SOM as a TCP server on the robots.

Detkin Lab, Penn ESE

ESE Lab Leader

Jan 2026 to present

I help students in Penn's embedded and circuit labs with instruments and components, and troubleshoot measurement, equipment, and circuit problems. I also run lab procurement: I maintain the inventory tracker and source parts from DigiKey, McMaster-Carr, and Amazon.

Instrument tutorials I made for the lab: power supply and mixed-signal oscilloscope.

Projects

12010080 1 MHz100 MHz10 GHz |Z| (dBΩ) 109 dBΩ −3 dB 492 MHz

Analog IC designAug 2025 to Dec 2025

Wideband Transimpedance Amplifier in 45 nm CMOS

  • 1 V CMOS TIA for photodiode front ends.
  • 109 dBΩ transimpedance gain, ~492 MHz bandwidth, ~4.5e-14 A²/Hz input-referred noise, 2.76 mW power.

Tools: Cadence Virtuoso, Spectre.

REFVCO VCO freq 4.15 GHz unlocked LOCKED

Analog/mixed-signal IC design2024

Phase-Locked Loop for SerDes Clock Generation in 180 nm CMOS

  • Charge-pump PLL for SerDes clocking: phase-frequency detector, charge pump with loop filter, 3-stage ring VCO, and frequency divider.
  • 4.44 GHz output at 1.8 V supply with 50% duty cycle, from transient simulation (typical corner, 25 °C).

Undergraduate capstone, team of four. Tools: Cadence Virtuoso, Spectre. GitHub repo →

WL BLBLB VDD QQ̄ WLBLBLB WL SA 3.348 ps

Memory circuit designSep 2025 to Dec 2025

16×4 SRAM Memory Circuit

  • Read access delay 3.348 ps.
  • Cut power from 131 µW at 1.2 V to 33 µW at 1.0 V through supply-voltage scaling.
SOI die mounted in the center of a gold-plated carrier board, held in a gloved hand under cleanroom yellow light
SOI die on a carrier board, ESE 5360.

NanofabricationJan 2026 to May 2026

Cleanroom Device Fabrication (ESE 5360)

  • 60 hours of hands-on cleanroom work: photolithography, EBL, RIE/DRIE plasma etch, PECVD and sputtered thin films, ALD, wet processing, device release.
  • Fabricated MEMS actuators on SOI. Verified the 2.6 µm device layer by reflectometry.
  • Patterned PS-b-PMMA by directed self-assembly with 23 nm feature heights.
  • Also worked on graphene transistors and CdSe quantum dot synthesis.
1234 A 00.20.40.6 V IRLML0040 · RDS(on) = 65.1 mΩ STPS360AFVFWD = 0.330 V

Power electronicsSep 2026 to present

Power Device Characterization (ESE 5800)

  • Characterized an STPS360AF Schottky diode and an IRLML0040 MOSFET from 0.02 to 4 A with pulsed bench measurements.
  • Automated the measurements in Python/PyVISA on Keysight E36441A and 34461A instruments.
  • Fit simplified models (VFWD = 0.330 V, RON = 66.5 mΩ, RDS(on) = 65.1 mΩ) and validated them against vendor SPICE models and datasheet curves.
Girish standing next to the Robust Compute-in-Memory for Edge Healthcare poster
Presenting the compute-in-memory poster, ESE 5760.

Semiconductor memoryJan 2026 to May 2026

Robust Compute-in-Memory for Edge Healthcare (ESE 5760)

  • Modeled OxRAM and PCM 2T2R crossbar non-idealities (RTN, conductance drift) inside hardware-aware training of a 1D-CNN ECG classifier.
  • PCM showed 11% lower energy-delay product (0.0275 µJ per inference).

Edge AI hardware2025

NeuroSense

  • Real-time mental health monitor that runs entirely on the device. It combines facial emotion recognition, speech cues, and EEG to detect stress, anxiety, and other emotional states.
  • Hardware: STM32N6570-DK with its built-in NPU, an EEG front end with instrumentation amplifier and filtering, a YOLOv8-based emotion model, and a TouchGFX touchscreen UI.
  • Global 3rd place, Elektor-STM32 Edge-AI Competition 2025. 423+ entries from 31+ countries. €1,000 prize.

With Kartik Khandelwal and Viren Sharma.

Wearable2025

NeuroBand

  • Safety armband for elderly and high-risk users. It detects falls and tracks heart rate and ECG. On a fall it sounds an SOS alarm and sends a Wi-Fi alert to a caregiver app with the ECG recorded just before the event.
  • Hardware: ESP32-S3 running an on-device fall classifier on accelerometer and gyroscope data, plus heart-rate and ECG sensors.
  • Top 10 of 2,959, Circuit Digest Smart Home and Wearables Project Contest 2025.

With Kartik Khandelwal.

Basys-3 (Artix-7) FPGA RCreceiver MPU-6050IMU FPVcamera PWMdecoders ×4 I2Cmaster PIDcontroller PWMencoder ESC ×4motors FPV link is separate

Digital design / FPGA2024

FPGA Flight Controller for a Quadcopter

  • Quadcopter flight controller written in HDL on a Basys-3 (Artix-7) FPGA instead of a microcontroller.
  • Modules: PWM decoders for throttle, yaw, pitch, and roll from the RC receiver, an I2C master for the MPU-6050 IMU, a PID controller, and a PWM encoder driving the ESCs.
  • My part: interfacing the peripherals with the FPGA, the FPV camera, and the PWM encoder and decoder HDL. All four motors synchronized with the transmitter and receiver.

Team project, Thapar. Tools: Xilinx Vivado. GitHub repo →

Skills

Fab and process
  • Photolithography
  • EBL (Raith EBPG)
  • ALD
  • Sputtering (PVD)
  • PECVD
  • RIE/DRIE
  • Wet processing
  • Device release
Metrology and characterization
  • SEM
  • AFM
  • Spectroscopic ellipsometry (WVASE)
  • XRD
  • Reflectometry
  • Profilometry
  • White-light interferometry
  • Pulsed I-V (PyVISA)
Design and simulation
  • Cadence Virtuoso
  • Spectre
  • LTspice
  • NVSim
  • NeuroSim
  • Tanner
  • Xilinx Vivado
  • Mentor PADS
  • KiCad
Test and debug
  • Oscilloscope (differential and current probes)
  • Logic analyzer
  • Spectrum analyzer
  • Signal generator
  • DMM
  • LCR meter
Programming
  • Python (data analysis, PyVISA instrument automation, PyTorch)
  • MATLAB
  • C
  • Verilog